Effect of Micro-channel Cross-section and Coolant Pressure on Two-Phase CoolingPritish Parida2024ITherm 2024
Reduced Physics Modeling of Two-Phase Flow through High-Density Cooling StructuresPritish ParidaShurong Tianet al.2024ITherm 2024
Reliable Direct Bonded Heterogeneous Integration ( DBHI) for AI HardwareDivya TanejaKatherine Pilgeret al.2024DPC 2024
Design of Analog-AI Hardware Accelerators for Transformer-based Language Models (Invited)Geoffrey BurrSidney Tsaiet al.2023IEDM 2023
SyncTREE: Fast Timing Analysis for Integrated Circuit Design through a Physics-informed Tree-based Graph Neural NetworkYuting HuJiajie Liet al.2023NeurIPS 2023
Design of synchronous frequency dividers in 5-nm FinFET CMOS technologyMarcel KosselPier Andrea Franceseet al.2023Electronics Letters
Towards a Formally Verified Security Monitor for VM-based Confidential ComputingWojciech OzgaGuerney Huntet al.2023MICRO 2023
The impact of Al on contact resistance and its suitability in fine pitch interconnectsFee Li LieSathya Raghavanet al.2023IMAPS 2023
A Methodology to Optimize Laser Dicing Parameters to Maximize Dicing Quality Through Machine LearningSathya RaghavanAakrati Jainet al.2023ECTC 2023
On the path to AI hardware via chiplet integration enabled by high density organic substratesGriselda BonillaBrian Quinlanet al.2023ECTC 2023