Publications

This is our catalog of publications authored by IBM researchers, in collaboration with the global research community. It’s an ever-growing body of work that shows why IBM is one of the most important contributors to modern computing.

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46 results for Chiplets

Plating-free Bumping by Cu Nanopaste and Injection Molded Solder (IMS) for Fine Pitch Flip Chip Joining
- - Toyohiro Aoki
  - Eiji Nakamura
  - et al.
- 2020
- ECTC 2020
Proposal of Package Structure Requirements for Effective Cooling from the Bottom Side of Chips (from the Substrate Side), Aiming for a Three-Dimensional (3D) Chip Stack
- - Keiji Matsumoto
  - Hiroyuki Mori
- 2016
- ECTC 2016
Design of Analog-AI Hardware Accelerators for Transformer-based Language Models (Invited)
- - Geoffrey Burr
  - Sidney Tsai
  - et al.
- 2023
- IEDM 2023
Optical Communication and Energy Conversion for Small-Footprint Edge Computing
- - Ning Li
- 2020
- MRS Spring/Fall Meeting 2020
Artificial Intelligence (AI) based methodology to minimize asymmetric bare substrate warpage
- - Sathya Raghavan
  - Hiroyuki Mori
  - et al.
- 2023
- ECTC 2023
Towards a Formally Verified Security Monitor for VM-based Confidential Computing
- - Wojciech Ozga
  - Guerney Hunt
  - et al.
- 2023
- MICRO 2023
AI chiplets in an open ecosystem: barriers and solution approaches
- - Daniel Friedman
- 2024
- DAC 2024
Reduced Physics Modeling of Two-Phase Flow through High-Density Cooling Structures
- - Pritish Parida
  - Shurong Tian
  - et al.
- 2024
- ITherm 2024
Effect of Micro-channel Cross-section and Coolant Pressure on Two-Phase Cooling
- - Pritish Parida
- 2024
- ITherm 2024
Reliable Direct Bonded Heterogeneous Integration ( DBHI) for AI Hardware
- - Divya Taneja
  - Katherine Pilger
  - et al.
- 2024
- DPC 2024