Plating-free Bumping by Cu Nanopaste and Injection Molded Solder (IMS) for Fine Pitch Flip Chip Joining
- Toyohiro Aoki
- Eiji Nakamura
- et al.
- 2020
- ECTC 2020
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49 results for Chiplets
Proposal of Package Structure Requirements for Effective Cooling from the Bottom Side of Chips (from the Substrate Side), Aiming for a Three-Dimensional (3D) Chip Stack
- Keiji Matsumoto
- Hiroyuki Mori
- 2016
- ECTC 2016
D2W and W2W Hybrid bonding system with below 2.5 micron pitch for 3D chiplet AI applications
- Katsuyuki Sakuma
- Roy Yu
- et al.
- 2024
- IEDM 2024
Design of Analog-AI Hardware Accelerators for Transformer-based Language Models (Invited)
- Geoffrey Burr
- Sidney Tsai
- et al.
- 2023
- IEDM 2023
Optical Communication and Energy Conversion for Small-Footprint Edge Computing
- Ning Li
- 2020
- MRS Spring/Fall Meeting 2020
Artificial Intelligence (AI) based methodology to minimize asymmetric bare substrate warpage
- Sathya Raghavan
- Hiroyuki Mori
- et al.
- 2023
- ECTC 2023
Towards a Formally Verified Security Monitor for VM-based Confidential Computing
- Wojciech Ozga
- Guerney Hunt
- et al.
- 2023
- MICRO 2023
AI chiplets in an open ecosystem: barriers and solution approaches
- Daniel Friedman
- 2024
- DAC 2024
A NRZ/PAM4 SST TX in 5nm FinFET CMOS with 3-tap FFE and 0.7pJ/b efficiency at 100 Gb/s PAM4
- 2024
- ESSERC 2024
Reduced Physics Modeling of Two-Phase Flow through High-Density Cooling Structures
- Pritish Parida
- Shurong Tian
- et al.
- 2024
- ITherm 2024