The thermal stability of CoSi2 on polycrystalline silicon: The effect of silicon grain size and metal thickness
- J.P. Gambino
- E.G. Colgan
- et al.
- 1998
- JES
Publications
509 results at JES
Use of polyaniline and its derivatives in corrosion protection of copper and silver
- Vlasta Brusic
- Marie Angelopoulos
- et al.
- 1997
- JES
High temperature reactive ion etching of indium-tin oxide
- Yue Kuo
- 1997
- JES
Anisotropic etching of a novalak-based polymer at cryogenic temperature
- R. Hsiao
- K. Yu
- et al.
- 1997
- JES
Use of SiBN and SiBON films prepared by plasma enhanced chemical vapor deposition from borazine as interconnection dielectrics
- W.F. Kone
- S. Cohen
- et al.
- 1997
- JES
Nonlinear dynamics of limiting current in the flow-modulated uniform-injection cell
- J. Antonio Medina
- Daniel T. Schwarte
- 1997
- JES
Wettability of polished silicon oxide surfaces
- Richard R. Thomas
- Frank B. Kaufman
- et al.
- 1996
- JES
Nonphotosensitive, vertically redundant two-channel a-Si:H thin film transistor
- Yue Kuo
- 1996
- JES
Impact of the electrochemical properties of silicon wafer surfaces on copper outplating from HF solutions
- I. Teerlinck
- P.W. Mertens
- et al.
- 1996
- JES
Etching of tantalum in fluorine-containing high density plasmas
- R. Hsiao
- D.C. Miller
- 1996
- JES