The effect of grain size on microstructure and stress relaxation in polycrystalline Y1Ba2Cu3O7-δ
- T.M. Shaw
- S. Shinde
- et al.
- 2011
- Journal of Materials Research
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Interface modifications for improving the adhesion of a-c:H films to metals
- A. Grill
- B.S. Meyerson
- et al.
- 2011
- Journal of Materials Research
Transformation Toughening of Glass Ceramics
- D.R. Clarke
- B. Schwartz
- 2011
- Journal of Materials Research
Stress gradients observed in Cu thin films induced by capping layers
- Conal E. Murray
- Paul R. Besser
- et al.
- 2011
- Journal of Materials Research
Stress and thermal expansion of β-SiC films by the vibrating-membrane method
- B.S. Berry
- W.C. Pritchet
- et al.
- 2011
- Journal of Materials Research
Sol-gel route to high Tc ceramic precursors
- Tom Karis
- J. Economy
- 2011
- Journal of Materials Research
Germanium supersaturation during the crystallization of amorphous Te-Ge-Sn thin films
- M. Libera
- M. Chen
- et al.
- 2011
- Journal of Materials Research
Instrumentation of A Conventional Hardness Tester for Load-Displacement Measurement During Indentation
- R.F. Cook
- 2011
- Journal of Materials Research
X-ray depth profiling of iron oxide thin films
- Michael F. Toney
- Ting C. Huang
- et al.
- 2011
- Journal of Materials Research
Possible Evidence for Overcoordination at Semiconductor Grain Boundaries
- W. Krakow
- A.A. Levi
- et al.
- 2011
- Journal of Materials Research