Biaxial orientation of polypropylene by hydrostatic solid state extrusion. Part I: Orientation mechanism and structural hierarchy
- S.J. Pan
- H.R. Brown
- et al.
- 2004
- Polymer Engineering & Science
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45 results at Polymer Engineering & Science
Concerning voids in polyimide
- T.P. Russell
- 2004
- Polymer Engineering & Science
Organosilicon polymers for lithographic applications
- J.M. Shaw
- M. Hatzakis
- et al.
- 2004
- Polymer Engineering & Science
Chemical amplification in the design of dry developing resist materials
- Hiroshi Ito
- C. Grant Willson
- 2004
- Polymer Engineering & Science
Soluble polysilanes: An interesting new class of radiation sensitive materials
- R.D. Miller
- D. Hofer
- et al.
- 2004
- Polymer Engineering & Science
X‐ray determination of encapsulation stresses on silicon wafers
- L.T. Nguyen
- I.C. Noyan
- 2004
- Polymer Engineering & Science
Residual stresses in polymeric passivation and encapsulation materials
- I.C. Noyan
- L.T. Nguyen
- 2004
- Polymer Engineering & Science
Bubble formation mechanism during heat treatment of polymer films cast from solutions
- Ho‐Ming Tong
- Augustus C. Ouano
- 2004
- Polymer Engineering & Science
Parameters, affecting the sensitivity of poly(methyl methacrylate) as a positive lithographic resist
- Edward Gipstein
- Augustus C. Ouano
- et al.
- 2004
- Polymer Engineering & Science
Recent advances in the photodecomposition mechanisms of diazo‐oxides
- J. Pacansky
- 2004
- Polymer Engineering & Science