Repassivation Transients Measured with the Breaking-Electrode Technique on Aluminum Thin-Film SamplesC.V. JahnesV. Brusicet al.1995JES
Electrochemical Fabrication of Mechanically Robust PbSn C4 InterconnectionsJ. RoederH. Deligianniet al.1995JES
Fabrication of an array of precision nozzles by through-mask electrochemical micromachiningMadhav Datta1995JES
PECVD Silicon Nitride as a Gate Dielectric for Amorphous Silicon Thin Film Transistor Process and Device PerformanceYue Kuo1995JES
Laser-Assisted Seeding for Electroless Plating on Polyimide SurfacesA.G. SchrottBodil Brarenet al.1995JES