A Multiscale Workflow for Thermal Analysis of 3DI Chip Stacks
- Max Bloomfield
- Amogh Wasti
- et al.
- 2025
- ITherm 2025
Publications
277 results for AI Hardware
Self-Alignment of Active Si Bridge using Solder Joint Capillary Forces
- Thomas Lesueur
- David Danovitch
- et al.
- 2025
- ECTC 2025
Electrical Performance of Hybrid Bonding with Sub-Micron Cu-Cu Bonding Contacts: Effects of Scaling, Microstructure, and Surface Morphology
- Sari Al Zerey
- Alina Bennett
- et al.
- 2025
- ECTC 2025
Fast and Accurate Machine Learning Prediction of Back-End-of-Line Thermal Resistances in Backside Power Delivery and Chiplet Architectures
- Prabudhya Roy Chowdhury
- Aakrati Jain
- et al.
- 2025
- ECTC 2025
Experimental Cross-Plane Thermal Transport Characterization of BEOL Materials and Sensitivity to In-Plane Thermal Transport
- Amogh Wasti
- Zongmin Yang
- et al.
- 2025
- ITherm 2025
Effect of Pressure-dependent TIM Thermal Resistance on Thermal Performance of First-level Packages
- KALIND BARAYA
- Krishna Tunga
- et al.
- 2025
- ITherm 2025
NIMA: Near In-Memory High-Precision Accumulation Unit for Heterogeneous Analog/Digital Deep Learning Acceleration
- Irem Sanli
- Elena Ferro
- et al.
- 2025
- ISCAS 2025
Live Demonstration: Automated DNN Deployment on the IBM HERMES Project Chip
- Corey Lammie
- Julian Büchel
- et al.
- 2025
- ISCAS 2025
All-in-One Analog AI Hardware: On-Chip Training and Inference with Conductive-Metal-Oxide/HfOx ReRAM Devices
- Donato Francesco Falcone
- Victoria Clerico
- et al.
- 2025
- Advanced Functional Materials
Analog AI Accelerators for Transformer-based Language Models: Hardware, Workload, and Power Performance
- H. Tsai
- H. Benmeziane
- et al.
- 2025
- IMW 2025