Effects of under bump metallization and nickel alloying element on the undercooling behavior of Sn-based, Pb-free solders
- Moon Gi Cho
- Sung K. Kang
- et al.
- 2011
- Journal of Materials Research
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Stress gradients observed in Cu thin films induced by capping layers
- Conal E. Murray
- Paul R. Besser
- et al.
- 2011
- Journal of Materials Research
Undercooling and microhardness of Pb-free solders on various under bump metallurgies
- Moon Gi Cho
- Sung K. Kang
- et al.
- 2008
- Journal of Materials Research
Properties of ultrathin platinum deposited by atomic layer deposition for nanoscale copper-metallization schemes
- Yu Zhu
- Kathleen A. Dunn
- et al.
- 2007
- Journal of Materials Research
Mechanism of electromigration-induced failure in flip-chip solder joints with a 10-μm-thick Cu under-bump metallization
- Jae-Woong Nah
- Kai Chen
- et al.
- 2007
- Journal of Materials Research
Study of the undercooling of Pb-free, flip-chip solder bumps and in situ observation of solidification process
- Sung K. Kang
- M.G. Cho
- et al.
- 2007
- Journal of Materials Research
Structural domains in antiferromagnetic LaFeO3thin films
- Jin Won Seo
- Christel Dieker
- et al.
- 2006
- Journal of Materials Research
Structural domains in antiferromagnetic LaFeO3 thin films
- Jin Won Seo
- Christel Dieker
- et al.
- 2006
- Journal of Materials Research
Resistivity-temperature behavior of dilute Cu(Ir) and Cu(W) alloy films
- Katayun Barmak
- Jr. Cabral
- et al.
- 2005
- Journal of Materials Research
Nanoindentation analysis of mechanical properties of low to ultralow dielectric constant SiCOH films
- Lugen Wang
- M. Ganor
- et al.
- 2005
- Journal of Materials Research