Ag3Sn plate formation in the solidification of near ternary eutectic Sn-Ag-Cu alloys
- Donald W. Henderson
- Timothy Gosselin
- et al.
- 2002
- Journal of Materials Research
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Texture in Ti/Al and Nb/Al multilayer thin films: Role of Cu
- G.A. Lucadamo
- Katayun Barmak
- et al.
- 2001
- Journal of Materials Research
Evaluation of the modified edge lift-off test for adhesion characterization in microelectronic multifilm applications
- Jack C. Hay
- Eric G. Liniger
- et al.
- 2001
- Journal of Materials Research
Oxygen stoichiometry in PdOx and PdOxPt electrode layers during processing of ferroelectric and high-epsilon perovskites
- K.L. Saenger
- C. Cabral Jr.
- et al.
- 2000
- Journal of Materials Research
Plasticity contributions to interface adhesion in thin-film interconnect structures
- Michael Lane
- Reinhold H. Dauskardt
- et al.
- 2000
- Journal of Materials Research
Optimization of Ta-Si-N thin films for use as oxidation-resistant diffusion barriers
- C. Cabral
- K.L. Saenger
- et al.
- 2000
- Journal of Materials Research
Mechanisms for enhanced C54-TiSi2 formation in Ti-Ta alloy films on single-crystal Si
- A. Quintero
- M. Libera
- et al.
- 1999
- Journal of Materials Research
Critical examination of the fundamental relations used in the analysis of nanoindentation data
- Jack C. Hay
- A. Bolshakov
- et al.
- 1999
- Journal of Materials Research
Al-Ta bilayer as an oxidation resistant barrier for electrode structures in high dielectric constant capacitors
- A. Grill
- C. Cabral Jr.
- 1999
- Journal of Materials Research
Layered TaSiN as an oxidation resistant electrically conductive barrier
- A. Grill
- C.V. Jahnes
- et al.
- 1999
- Journal of Materials Research