Spiral and solenoidal inductor structures on silicon using Cu-damascene interconnectsD. EdelsteinJ.N. Burghartz1998IITC 1998
Copper dual damascene wiring for sub-0.25 μm CMOS technologyJ. HeidenreichD. Edelsteinet al.1998IITC 1998
Dielectric anti-reflection coating application in a 0.175 μm dual-damascene processG.Y. LeeZ.G. Luet al.1998IITC 1998