An alternative low resistance MOL technology with electroplated rhodium as contact plugs for 32nm CMOS and beyond
- I. Shao
- J.M. Cotte
- et al.
- 2007
- IITC 2007
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6 results at IITC 2007
Impact of Cu microstructure on electromigration reliability
- C.-K. Hu
- L. Gignac
- et al.
- 2007
- IITC 2007
Chip-package-interaction modeling of ultra low-k/copper back end of line
- X.-H. Liu
- T.M. Shaw
- et al.
- 2007
- IITC 2007
Experimental determination of the toughness of crack stop structures
- T.M. Shaw
- E. Liniger
- et al.
- 2007
- IITC 2007
Reliability of Cu interconnects with Ta implant
- J.P. Gambino
- T.D. Sullivan
- et al.
- 2007
- IITC 2007
Advanced Cu/low-k BEOL integration, reliability, and extendibility
- Daniel C. Edelstein
- 2007
- IITC 2007