Formation of Ag3Sn plates in Sn-Ag-Cu alloys and optimization of their alloy compositionSung K. KangWon Kyoung Choiet al.2003ECTC 2003
Study of IMC morphologies and phase characteristics affected by the reactions of Ni and Cu metallurgies with Pb-free solder jointsWon Kyoung ChoiSung K. Kanget al.2003ECTC 2003
A method of multi-node thermal network extraction for SPICE compatible simulationsLei ShanDaniel Kuchtaet al.2003ECTC 2003
Model-to-hardware correlations in the design of a 50Gb/s packageLei ShanMounir Meghelliet al.2003ECTC 2003