A study of electromigration lifetime for Cu interconnects coated with CoWP, Ta/TaN, or SiC xN yH z
- C.-K. Hu
- D. Canaperi
- et al.
- 2003
- AMC 2003
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5 results at AMC 2003
Simulation of the deposition of BCC metals including anistropic effects using 3D-films
- T. Smy
- R.V. Joshi
- 2003
- AMC 2003
Growth of crystalline defects on the surface of FSG dielectrics
- J.P. Gambino
- J. Burnham
- et al.
- 2003
- AMC 2003
Analysis of an extreme low-κ organosilicate dielectric film exposed to representative plasmas and to a restorative process
- M. Colburn
- S.V. Nitta
- et al.
- 2003
- AMC 2003
Backend implications for thermal effects in 3d integrated soi structures
- D. Celo
- R.V. Joshi
- et al.
- 2003
- AMC 2003