Impact of die-to-die thermal coupling on the electrical characteristics of 3D stacked SRAM cacheSubho ChatterjeeMinki Choet al.2012SEMI-THERM 2012
Measurement of microbump thermal resistance in 3D chip stacksE.G. ColganPaul Andryet al.2012SEMI-THERM 2012
Sustainable data centers powered by renewable energyLevente J. KleinSergio Bermudezet al.2012SEMI-THERM 2012
Experimental investigation of water cooled server microprocessors and memory devices in an energy efficient chiller-less data centerPritish R. ParidaMilnes Davidet al.2012SEMI-THERM 2012
Experimental characterization of an energy efficient chiller-less data center test facility with warm water cooled serversMilnes P. DavidMadhusudan Iyengaret al.2012SEMI-THERM 2012