Ultrathin (5-35 nm) SiCNH dielectrics for damascene Cu Cap application: Thickness scaling and oxidation barrier performance limitation
- Son Nguyen
- T. Haigh Jr.
- et al.
- 2010
- ECS Meeting 2010
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Using CMP model for 45nm/32nm BEOL process and design evaluations
- Laertis Economikos
- Jerry Bao
- et al.
- 2010
- ECS Meeting 2010