Crystallization Properties of Al-Sb Alloys for Phase Change Memory Applications
- Rubab Ume
- Haibo Gong
- et al.
- 2021
- ECS J. Solid State Sci. Technol.
Publications
This is our catalog of publications authored by IBM researchers, in collaboration with the global research community. It’s an ever-growing body of work that shows why IBM is one of the most important contributors to modern computing.
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17 results at ECS J. Solid State Sci. Technol.
Understanding the Reasons behind Defect Levels in Post-Copper-CMP Cleaning Processes with Different Chemistries and PVA Brushes
- Y. Sampurno
- A. Philipossian
- et al.
- 2021
- ECS J. Solid State Sci. Technol.
Process Co-Optimization of CVD and CMP for Tungsten Metallization
- Shanti Pancharatnam
- Wei Tsu Tseng
- et al.
- 2020
- ECS J. Solid State Sci. Technol.
CMP development for Ru liner structures beyond 14nm
- Raghuveer Patlolla
- Koichi Motoyama
- et al.
- 2018
- ECS J. Solid State Sci. Technol.
Accurate measurement of porous low-k thin-films by nanoindentation: Densification scaling versus substrate effects
- Krystelle Lionti
- Kumar Virwani
- et al.
- 2017
- ECS J. Solid State Sci. Technol.
Low hydrogen silicon carbon nitride cap for high performance sub-10 nm Cu-low k interconnect
- Son Van Nguyen
- Shobha Hosadugra
- et al.
- 2017
- ECS J. Solid State Sci. Technol.
A study on the long-term degradation of crystalline silicon solar cells metallized with Cu electroplating
- Qiang Huang
- Kathleen B. Reuter
- et al.
- 2015
- ECS J. Solid State Sci. Technol.
A study on the electrodeposition and silicidation of Nickel-Cobalt alloys for silicon photovoltaic cell metallization
- Qiang Huang
- 2015
- ECS J. Solid State Sci. Technol.
Light assisted electrodeposition and silicidation of Ni for silicon photovoltaic cell metallization
- Qiang Huang
- Satyavolu S. Papa Rao
- et al.
- 2015
- ECS J. Solid State Sci. Technol.
Microreplicated conditioners for Cu barrier chemical-mechanical planarization (CMP)
- Wei-Tsu Tseng
- Sana Rafie
- et al.
- 2015
- ECS J. Solid State Sci. Technol.