Shot noise thermometry for thermal characterization of templated carbon nanotubes
- Robert A. Sayer
- Sunkook Kim
- et al.
- 2010
- IEEE Transactions on Components and Packaging Technologies
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8 results at IEEE Transactions on Components and Packaging Technologies
Rapid three-dimensional thermal characterization of large-scale computing facilities
- Hendrick F. Hamann
- James A. Lacey
- et al.
- 2008
- IEEE Transactions on Components and Packaging Technologies
High heat flux two-phase cooling in silicon multimicrochannels
- Bruno Agostini
- John Richard Thome
- et al.
- 2008
- IEEE Transactions on Components and Packaging Technologies
Investigation of the impact of power granularity on chip thermal modeling using white noise analysis
- Keivan Etessam-Yazdani
- Mehdi Asheghi
- et al.
- 2008
- IEEE Transactions on Components and Packaging Technologies
A practical implementation of silicon microchannel coolers for high power chips
- Evan G. Colgan
- Bruce Furman
- et al.
- 2007
- IEEE Transactions on Components and Packaging Technologies
Hierarchically nested channels for fast squeezing interfaces with reduced thermal resistance
- Thomas Brunschwiler
- Urs Kloter
- et al.
- 2007
- IEEE Transactions on Components and Packaging Technologies
Development of conductive adhesive materials for via fill applications
- Sung K. Kang
- Stephen L. Buchwalter
- et al.
- 2001
- IEEE Transactions on Components and Packaging Technologies
Effect of nonconducting filler additions on ACA properties and the reliability of ACA flip-chip on organic substrates
- Myung-Jin Yim
- Kyung-Wook Paik
- 2001
- IEEE Transactions on Components and Packaging Technologies