Electrical and structural properties of coevaporated NiSi2 ± x thin films
- I Grimberg
- B.Z Weiss
- et al.
- 1989
- Acta Metallurgica
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43 results at Acta Metallurgica
A re-examination of the analysis of toughening in brittle-matrix composites
- M.D Thouless
- 1989
- Acta Metallurgica
Direct observation of dislocation emission from crack tips in silicon at high temperatures
- Y.-H. Chiao
- D.R. Clarke
- 1989
- Acta Metallurgica
A discrete lattice plane analysis of the energy of coherent {0001}h.c.p. • {111}f.c.c., 〈1120〉h.c.p.• 〈110〉f.c.c. interfaces
- R.V. Ramanujan
- J.K. Lee
- et al.
- 1989
- Acta Metallurgica
Deformation during interdiffusion
- G.Brian Stephenson
- 1988
- Acta Metallurgica
Fracture stability, R-curves and strength variability
- R.F. Cook
- D.R. Clarke
- 1988
- Acta Metallurgica
Cr75Si25 thin films-Temperature dependence of electrical properties and microstructure
- B.Z. Weiss
- K.N. Tu
- et al.
- 1986
- Acta Metallurgica
The development of grain structure during growth of metallic films
- C.R.M. Grovenor
- H.T.G. Hentzell
- et al.
- 1984
- Acta Metallurgica
Grain size and growth of Ni-Rich Ni-Al alloy films
- H.T.G. Hentzell
- B. Andersson
- et al.
- 1983
- Acta Metallurgica
Kinetics of interfacial reaction in bimetallic CuSn thin films
- K.N. Tu
- R.D. Thompson
- 1982
- Acta Metallurgica