Publications

3 results at Proceedings - Electronic Components and Technology Conference

Interfacial reactions, microstructure and mechanical properties of Pb-free solder joints in PBGA laminates
- - S.K. Kang
  - W.K. Choi
  - et al.
- 2002
- Proceedings - Electronic Components and Technology Conference
Development of conductive adhesive materials for via fill applications
- - Sung K. Kang
  - Stephen L. Buchwalter
  - et al.
- 2000
- Proceedings - Electronic Components and Technology Conference
Bandwidth prediction for high-performance interconnections
- - A. Deutsch
  - G.V. Kopcsay
  - et al.
- 2000
- Proceedings - Electronic Components and Technology Conference