Dominik Metzler

Dominik joined IBM in 2016 after graduating from the University of Maryland and an internship in Yorktown as part of an SRC project. His primary role has been in BEOL RIE, but he has branched out to make contributions in many other areas. His knowledge and expertise widened to development of TopVia Patterning in Interconnect 3.0, including design, lithography and metrology. Dominik is now a well-published project lead for the Bald Eagle and Titan Programs with multiple invited talks and over twenty IBM patents. His graduate research work on ALE and precursors continues to be a key contribution to the state-of-the-art in semiconductor process technology. He is the recipient of seven Mangers' Choice Awards and a recent attendee of IBM Tech 2024. Dominik has been recognized as a key member in many achievements including the 2019 IBM Research Accomplishment: 300mm MRAM technology: Fully Functional 32Mb STT-MRAM chips, the 2022 MRAM 22nm 1Gb A-level Accomplishment, and the 2023 IBM Research Accomplishment: Interconnect 3.0: Technology development of subtractive Ru with unique TopVia. Dominik’s current focus is on EUV via levels for the 2nm node.