Nelson Felix

Title

Director, Technical Business Development - IBM Semiconductors

Publications

Nanosheet Metrology Opportunities for Technology Readiness
- - Mary Breton
  - Daniel Schmidt
  - et al.
- 2021
- SPIE Advanced Lithography 2021
Fundamental characterization of stochastic variation for improved single-expose extreme ultraviolet patterning at aggressive pitch
- - Jennifer Church
  - Luciana Meli
  - et al.
- 2020
- J. Micro/Nanolithogr. MEMS MOEMS
Fundamental characterization of stochastic variation for improved single-expose EUV patterning at aggressive pitch
- - Jennifer Church
  - Luciana Meli
  - et al.
- 2020
- SPIE Advanced Lithography 2020
Measuring Local CD Uniformity in EUV vias with scatterometry and machine learning
- - Dexin Kong
  - Daniel Schmidt
  - et al.
- 2020
- SPIE Advanced Lithography 2020
Exploration of pillar local CDU improvement options for AI applications
- - Charlie Liu
  - Hao Tang
  - et al.
- 2020
- SPIE Advanced Lithography 2020
Overlay error statistics for multiple-exposure patterning
- - Allen Gabor
  - Nelson Felix
- 2019
- J. Micro/Nanolithogr. MEMS MOEMS
Electrical validation of the integration of 193i and DSA for sub-20nm metal cut patterning
- - Chi Chun Liu
  - Richard Farrell
  - et al.
- 2019
- MEMS/NEMS/MOEMS 2019
LCDU improvement of EUV-patterned vias with DSA
- - Jing Guo
  - Dustin W. Janes
  - et al.
- 2019
- MEMS/NEMS/MOEMS 2019
Investigation of mask absorber induced image shift in EUV lithography
- - Martin Burkhardt
  - Anuja De Silva
  - et al.
- 2019
- SPIE Advanced Lithography 2019
Fundamentals of resist stochastics effect for single-expose EUV patterning
- - Anuja De Silva
  - Luciana Meli
  - et al.
- 2019
- SPIE Advanced Lithography 2019

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Patents

- 28 Jan 2014
- US
- 8638438
Self-calibrated Alignment And Overlay Target And Measurement
- 29 Jan 2013
- US
- 8361683
Multi-layer Chip Overlay Target And Measurement

Blog posts

IBM and Albany partners unlock new yield benchmarks for EUV patterning
Technical note
Luciana Meli and Nelson Felix
24 Oct 2024
- Semiconductors
EUV patterning yield breakthrough sets new benchmark for logic scaling
Technical note
Nelson Felix and Luciana Meli
06 Nov 2020
4 minute read
IBM Research at SPIE 2020: New architectures and fabrications for AI hardware
Research
Nelson Felix
21 Feb 2020
4 minute read
- AI Hardware
- Semiconductors

Top collaborators

Luciana Meli

Senior Manager: Patterning & Metrology

Nicolas Loubet

STSM, Advanced Logic Technology Research

Mary Breton

Technical Assistant to Huiming Bu | Semiconductor Enablement Program Management & Infrastructure

Huiming Bu

Vice President: IBM Semiconductors Global R&D and Albany Operations