Nelson Felix

Title

Director, Technical Business Development - IBM Semiconductors

Publications

Towards production ready processing with a state-of-the-art EUV cluster
- - Karen Petrillo
  - Nicole Saulnier
  - et al.
- 2015
- SPIE Advanced Lithography 2015
EUV processing and characterization for BEOL
- - Nicole Saulnier
  - Yongan Xu
  - et al.
- 2015
- SPIE Advanced Lithography 2015
Characterization and mitigation of overlay error on silicon wafers with nonuniform stress
- - T.A. Brunner
  - V. Menon
  - et al.
- 2014
- SPIE Advanced Lithography 2014
CD optimization methodology for extending optical lithography
- - C. Wong
  - G. Seevaratnam
  - et al.
- 2013
- SPIE Advanced Lithography 2013
Characterization of wafer geometry and overlay error on silicon wafers with nonuniform stress
- - Timothy A. Brunner
  - Vinayan C. Menon
  - et al.
- 2013
- Journal of Micro/Nanolithography, MEMS, and MOEMS
High order wafer alignment in manufacturing
- - Michael Pike
  - Nelson Felix
  - et al.
- 2012
- SPIE Advanced Lithography 2012
Advanced overlay control in volume manufacturing
- - Timothy Wiltshire
  - Christopher Ausschnitt
  - et al.
- 2011
- ASMC 2011
Overlay improvement roadmap: Strategies for scanner control and product disposition for 5-nm overlay
- - Nelson M. Felix
  - Allen H. Gabor
  - et al.
- 2011
- SPIE Advanced Lithography 2011
Smaller, smarter, faster, and more accurate: The new overlay metrology
- - Nelson M. Felix
  - Allen H. Gabor
  - et al.
- 2010
- SPIE Advanced Lithography 2010
Simultaneous measurement of optical properties and geometry of resist using multiple scatterometry gratings
- - Alok Vaid
  - Matthew Sendelbach
  - et al.
- 2010
- SPIE Advanced Lithography 2010

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Patents

- 24 Jun 2024
- US
- 12019376
Polymer Brush Adhesion Promoter With Uv Cleavable Linker
- 24 Jun 2024
- US
- 12021135
Bottom Source/drain Etch With Fin-cut-last-vtfet
- 11 Mar 2024
- CN
- ZL 2018 8 0081456.1
Patterning Material Film Stack With Metal-containing Top Coat For Enhanced Sensitivity In Extreme Ultraviolet (euv) Lithography
- 30 Oct 2023
- US
- 11804401
Spacer-defined Process For Lithography-etch Double Patterning For Interconnects
- 10 Jul 2023
- US
- 11699592
Inverse Tone Pillar Printing Method Using Organic Planarizing Layer Pillars
- 03 Jul 2023
- US
- 11695059
Bottom Source/drain Etch With Fin-cut-last-vtfet
- 19 Jun 2023
- US
- 11681213
Euv Pattern Transfer Using Graded Hardmask
- 19 Jun 2023
- US
- 11682558
Fabrication Of Back-end-of-line Interconnects
- 08 May 2023
- US
- 11646221
Self-aligned Pattern Formation For A Semiconductor Device
- 24 Apr 2023
- JP
- 7268946
Patterning Directly On An Amorphous Silicon Hardmask

Blog posts

IBM and Albany partners unlock new yield benchmarks for EUV patterning
Technical note
Luciana Meli and Nelson Felix
24 Oct 2024
- Semiconductors
EUV patterning yield breakthrough sets new benchmark for logic scaling
Technical note
Nelson Felix and Luciana Meli
06 Nov 2020
4 minute read
IBM Research at SPIE 2020: New architectures and fabrications for AI hardware
Research
Nelson Felix
21 Feb 2020
4 minute read
- AI Hardware
- Semiconductors

Top collaborators

Luciana Meli

Senior Manager: Patterning & Metrology

Nicolas Loubet

STSM, Advanced Logic Technology Research

Mary Breton

Technical Assistant to Huiming Bu | Semiconductor Enablement Program Management & Infrastructure

Huiming Bu

Vice President: IBM Semiconductors Global R&D and Albany Operations