Christophe Rossel, Marilyne Sousa, et al.
Journal of Applied Physics
To develop a new generation of high-speed photonic modulators on silicon-technology-based photonics, new materials with large Pockels coefficients have been transferred to silicon substrates. Previous approaches focus on realizing stand-alone devices on dedicated silicon substrates, incompatible with the fabrication process in silicon foundries. In this work, we demonstrate monolithic integration of electro-optic modulators based on the Pockels effect in barium titanate (BTO) thin films into the back-end-of-line of a photonic integrated circuit (PIC) platform. Molecular wafer bonding allows fully PIC-compatible integration of BTO-based devices and is, as shown, scalable to 200 mm wafers. The PIC-integrated BTO Mach-Zehnder modulators outperform conventional Si photonic modulators in modulation efficiency, losses, and static tuning power. The devices show excellent VπL (0.2 Vcm) and VπLα (1.3 VdB), work at high speed (25 Gbps), and can be tuned at low-static power consumption (100 nW). Our concept demonstrates the possibility of monolithic integration of Pockels-based electro-optic modulators in advanced silicon photonic platforms.
Christophe Rossel, Marilyne Sousa, et al.
Journal of Applied Physics
Viacheslav Snigirev, Annina Riedhauser, et al.
ECOC 2022
Stefan Abel, Felix Eltes, et al.
Nature Materials
Stefan Abel, Thilo Stöferle, et al.
IPRSN 2013