K. Jackson, A.J. Moll, et al.
Proceedings of SPIE 1989
An optoelectronic transceiver module is described consisting of a four-channel AlGaAs integrated laser/monitor transmitter and a four-channel GaAs MESFET integrated detector/preamp receiver. The optoelectronic chips are flip-chip, solder-bump bonded to a substrate containing electrical wiring and planar-processed optical waveguides. The optical waveguide layer serves two purposes: The routing of optical signals, as well providing mechanical registrations for the optoelectronic chips and fiber-optic ribbon connector. The work described here demonstrates one approach to high-density, optoelectronic array packaging compatible with existing high-performance electronic packaging technology. © 1994 IEEE.
K. Jackson, A.J. Moll, et al.
Proceedings of SPIE 1989
Benjamin G. Lee, Jonathan E. Proesel, et al.
IPC 2012
G. Arjavalingam, Michael A. Russak, et al.
Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films
K. Jackson, Ch. Harder, et al.
IEEE Photonics Technology Letters