Flip-chip, self-aligned, optoelectronic transceiver module
K. Jackson, E.B. Flint, et al.
IEE/LEOS Summer Topical Meetings 1992
An optoelectronic transceiver module is described consisting of a four-channel AlGaAs integrated laser/monitor transmitter and a four-channel GaAs MESFET integrated detector/preamp receiver. The optoelectronic chips are flip-chip, solder-bump bonded to a substrate containing electrical wiring and planar-processed optical waveguides. The optical waveguide layer serves two purposes: The routing of optical signals, as well providing mechanical registrations for the optoelectronic chips and fiber-optic ribbon connector. The work described here demonstrates one approach to high-density, optoelectronic array packaging compatible with existing high-performance electronic packaging technology. © 1994 IEEE.
K. Jackson, E.B. Flint, et al.
IEE/LEOS Summer Topical Meetings 1992
M.S. Cohen, M.J. DeFranza, et al.
ECTC 1993
E.B. Flint
LEOS 1992
D. Liu, E.B. Flint, et al.
IEEE Transactions on Consumer Electronics