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PaperModeling and analysis of transistor mismatch due to variability in short-channel effect induced by random dopant fluctuationNauman Z. Butt, Jeffrey B. JohnsonIEEE Electron Device Letters
Conference paperReliable airgap BEOL technology in advanced 48 nm pitch copper/ULK interconnects for substantial power and performance benefitsC. J. Penny, S. Gates, et al.IITC 2017
ReviewDesign automation methodology and rf/analog modeling for rf CMOS and SiGe BiCMOS technologiesDavid L. Harame, Kim M. Newton, et al.IBM J. Res. Dev