Conference paper
Performance analysis of tapered gate in PD/SOI CMOS technology
W. Hwang, C.T. Chuang, et al.
VLSI-TSA 2001
A rapid and automated inspection system is a necessity for the detection of defects in x-ray and optical lithography masks. The design of an electron-beam mask inspection system requires a complete understanding of the backscattered electron signal from the various defects which will be encountered. A Monte Carlo simulation program has been used to study the effects of electron-beam size, detector placement, defect type, electron-beam voltage, and absorber thickness on the back-scattered electron signal.
W. Hwang, C.T. Chuang, et al.
VLSI-TSA 2001
R. Puri, C.T. Chuang, et al.
IEEE Journal of Solid-State Circuits
W. Molzen, Michael G. Rosenfield, et al.
Proceedings of SPIE 1989
Michael G. Rosenfield
Microlithography 1992