Xikun Hu, Wenlin Liu, et al.
IEEE J-STARS
The amorphous to face-centered cubic (fcc) and fcc to hexagonal close-packed (hcp) crystallization temperatures of GeSbTe thin films on underlying silicon nitride and silicon dioxide films were studied through slow (1 K/min) resistance versus temperature measurements. The amorphous to fcc phase transition is observed at ∼ 170 C for both cases but the fcc to hcp phase transition temperature for GeSbTe films on silicon nitride is observed to be ∼ 80 C lower than for GeSbTe films on silicon dioxide, possibly due to the hexagonal symmetry of silicon nitride. © 2013 Elsevier B.V. All Rights Reserved.
Xikun Hu, Wenlin Liu, et al.
IEEE J-STARS
Dipanjan Gope, Albert E. Ruehli, et al.
IEEE T-MTT
Hiroshi Ito, Reinhold Schwalm
JES
S.C. Lai, S. Kim, et al.
VLSI Technology 2013