Electromigration Cu mass flow in Cu interconnections
- C.-K. Hu
- D. Canaperi
- et al.
- 2006
- Thin Solid Films
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Structure of the silicon-oxide interface
- 2001
- Thin Solid Films
From tribological coatings to low-k dielectrics for ULSI interconnects
- A. Grill
- 2001
- Thin Solid Films
Prediction of recrystallization times in electroplated copper thin films
- Mikhail Treger
- C. Witt
- et al.
- 2016
- Thin Solid Films
Upconversion photoluminescence of epitaxial Yb3+/Er3+ codoped ferroelectric Pb(Zr,Ti)O3 films on silicon substrates
- Yang Zhang
- Thomas Kämpfe
- et al.
- 2016
- Thin Solid Films
Production of VO2 thin films through post-deposition annealing of V2O3 and VOx films
- Bart Van Bilzen
- P. Homm
- et al.
- 2015
- Thin Solid Films
Simplified formation process for Cu2ZnSnS4-based solar cells
- Dominik M. Berg
- Alexandre Crossay
- et al.
- 2014
- Thin Solid Films
Distinguishing mechanisms of morphological instabilities in phase change materials during switching
- M.K. Santala
- Simone Raoux
- et al.
- 2014
- Thin Solid Films
Compositional dependence of the optical conductivity of Ni1 - XPtx alloys (0 < x < 0.25) determined by spectroscopic ellipsometry
- Lina S. Abdallah
- Stefan Zollner
- et al.
- 2014
- Thin Solid Films
Formation of Si:CP layer through in-situ doping and implantation process for n-type metal-oxide-semiconductor devices
- Shogo Mochizuki
- Rainer Loesing
- et al.
- 2014
- Thin Solid Films