Wenwu Zhang, Y.Lawrence Yao, et al.
Journal of Manufacturing Science and Engineering
The (buried) interface between a polycrystalline Al thin-film feature and its substrate (single crystal Si) was characterized with x-ray microdiffraction. Using a focused x-ray beam (effective spot size on the specimen ∼2×12 μm) with the Si 004 reflection, topographic images of the Si around and under the metallization feature were constructed. Comparison with shear-lag model calculations indicate that the interface is not fully coupled despite the absence of surface cracks. © 1998 American Institute of Physics.
Wenwu Zhang, Y.Lawrence Yao, et al.
Journal of Manufacturing Science and Engineering
C.-K. Hu, L. Gignac, et al.
Applied Physics Letters
M.L. Green, A.J. Allen, et al.
Journal of Applied Physics
C. Cabral Jr., C. Lavoie, et al.
Thin Solid Films