Electromigration Cu mass flow in Cu interconnections
- C.-K. Hu
- D. Canaperi
- et al.
- 2006
- Thin Solid Films
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14 results for S. Kaldor
Effects of overlayers on electromigration reliability improvement for Cu/low K interconnects
- C.-K. Hu
- D. Canaperi
- et al.
- 2004
- IRPS 2004
Measurement volume considerations in X-ray microdiffraction stress analysis
- I.C. Noyan
- S. Kaldor
- 2004
- Powder Diffraction
Effects of overlayers on electromigration reliability improvement for Cu/low K interconnects
- C.-K. Hu
- D. Canaperi
- et al.
- 2004
- IRPS 2004
A study of electromigration lifetime for Cu interconnects coated with CoWP, Ta/TaN, or SiC xN yH z
- C.-K. Hu
- D. Canaperi
- et al.
- 2003
- AMC 2003
A 90nm dual damascene hybrid (organic / inorganic) low-k - Copper BEOL integration scheme
- T. Dalton
- A. Cowley
- et al.
- 2003
- ADMETA 2003
Comparison of Cu electromigration lifetime in Cu interconnects coated with various caps
- C.-K. Hu
- L. Gignac
- et al.
- 2003
- Applied Physics Letters
In situ study of void growth kinetics in electroplated Cu lines
- E. Liniger
- L. Gignac
- et al.
- 2002
- Journal of Applied Physics
Differentiating between elastically bent rectangular beams and plates
- S. Kaldor
- I.C. Noyan
- 2002
- Applied Physics Letters
Divergence effects in monochromatic x-ray microdiffraction using tapered capillary optics
- I.C. Noyan
- P.-C. Wang
- et al.
- 2000
- Review of Scientific Instruments