Characterization of water vapor plasma‐modified polyimide

Abstract

To enhance polyimide‐to‐polyimide adhesion, we have investigated the effect of surface modification in water vapor plasma. The use of a water vapor plasma to treat a fully cured polyimide (PMDA–ODA) surface before subsequent layers of polyimide are applied results in dramatically enhanced interfacial adhesion. The polyimide‐to‐polyimide interfacial adhesion strength attained following water vapor plasma treatment exceeds the cohesive strength of the applied polyimide layer. The effect of surface modification in water vapor plasma on metal‐to‐polyimide adhesion has also been investigated. The use of a water vapor plasma to treat a fully cured polyimide (PMDA–ODA) surface prior to metallization results in increased metal‐to‐polymer interfacial adhesion. A study of both electroless and vacuum‐deposited metal was conducted. The use of contact‐angle measurements, peel tests, Fourier transform infrared spectroscopy, optical emission spectroscopy, nuclear forward scattering, and X‐ray photoelectron spectroscopy has led us to a preliminary understanding of the resulting surface modification and the subsequent effect of adhesion promotion. © 1992 John Wiley & Sons, Inc. Copyright © 1992 John Wiley & Sons, Inc.