Coating, mechanical constraints, and pressure effects on electromigration

N.G. Ainslie; F.M. D&#039;Heurle; O.C. Wells

doi:10.1063/1.1654097

Applied Physics Letters

Paper

22 Oct 2003

Coating, mechanical constraints, and pressure effects on electromigration

View publication

Abstract

The effect of the mechanical constraints exerted by coatings upon electromigration in thin films is evaluated on the basis of known pressure effects upon diffusion. © 1972 The American Institute of Physics.

Paper

Thermal expansion of the isostructural PtSi and NiSi: Negative expansion coefficient in NiSi and stress effects in thin films

C. Detavernier, C. Lavoie, et al.

Journal of Applied Physics

Paper

The dominant diffusing species and initial phase formation in Al-Cu, Mg-Cu, and Mg-Ni systems

Q.Z. Hong, F.M. D'Heurle

Journal of Applied Physics

Paper

Formation of intermediate phases, Ni₃Si₂ and Pt ₆Si₅: Nucleation, identification, and resistivity

P. Gas, F.M. D'Heurle, et al.

Journal of Applied Physics

Paper

Formation of iridium silicides from Ir thin films on Si substrates

S. Petersson, J.E.E. Baglin, et al.

Journal of Applied Physics

View all publications

Abstract

Related

Thermal expansion of the isostructural PtSi and NiSi: Negative expansion coefficient in NiSi and stress effects in thin films

The dominant diffusing species and initial phase formation in Al-Cu, Mg-Cu, and Mg-Ni systems

Formation of intermediate phases, Ni3Si2 and Pt 6Si5: Nucleation, identification, and resistivity

Formation of iridium silicides from Ir thin films on Si substrates

Formation of intermediate phases, Ni₃Si₂ and Pt ₆Si₅: Nucleation, identification, and resistivity