Surendra B. Anantharaman, Joachim Kohlbrecher, et al.
MRS Fall Meeting 2020
Electromigration behavior and the kinetics of intermetallic formation in fine lines of Al/Hf/Al, Al/Ti/Al and Ti/Al/Ti as a function of Cu and Pd solute additions have been measured. In Hf/Al films, a second higher temperature eutectic reaction occurred, characterized by a resistance decrease and associated HfAl3 redistribution. In Ti/Al films a second intermetallic phase (Ti9Al23) formed, dependent on both the deposition technique and annealing temperature. The reliability implications of: (1) the high temperature eutectic reaction in Hf/Al films, and (2) Ti9Al23 phase formation in Ti/Al films were considered. © 1992.
Surendra B. Anantharaman, Joachim Kohlbrecher, et al.
MRS Fall Meeting 2020
Min Yang, Jeremy Schaub, et al.
Technical Digest-International Electron Devices Meeting
Arvind Kumar, Jeffrey J. Welser, et al.
MRS Spring 2000
G. Will, N. Masciocchi, et al.
Zeitschrift fur Kristallographie - New Crystal Structures