Conference paper
Role of Cu in TDDB of low-k dielectrics
J.R. Lloyd, S. Ponoth, et al.
IRPS 2007
A grain-by-grain analysis of the microstructural evolution in Sn stripe under electromigration using synchrotron-based white beam x-ray microdiffraction was investigated. Grain-by-grain analysis was obtained from the diffracted Laue patterns about the changes of grain orientation before and after electromigration. It was observed that high-resistance grains reorient with respect to the neighboring low-resistance grains. A different mechanism of grain growth under electromigration from the normal grain growth was also proposed and discussed.
J.R. Lloyd, S. Ponoth, et al.
IRPS 2007
A.G. Schrott, K.N. Tu, et al.
Physical Review B
G. Ottaviani, K.N. Tu, et al.
Physical Review Letters
M. Wittmer, C.-Y. Ting, et al.
Journal of Applied Physics