Environmental effects on cracking and delamination of dielectric films

Abstract

The effects of temperature and moisture on the adhesive and cohesive strength of dielectric materials and the interfaces that are composed of those materials commonly found in thin-film interconnect structures are reviewed. Debond growth rate versus debond driving energy curves (V-G curves) were collected over a range of environmental conditions for both dielectrics and dielectric/metal interfaces. Both are found to exhibit characteristics consistent with stress corrosion cracking mechanisms found in the bulk glass literature. The mechanisms identified in both systems are explained in terms of the salient chemical reactions occurring at the debond tip.