Joy Y. Cheng, Daniel P. Sanders, et al.
SPIE Advanced Lithography 2008
It has been almost thirty years since the first deep UV exposure was carried out and almost twenty five years since the term "deep UV lithography" was coined. Although resist systems classified as "chemical amplification resists" are the workhorse for the 248 nm deep UV lithography, the resist materials have evolved significantly in the realm of deep UV lithography as well as within the boundary of chemical amplification. This paper describes the evolution and progress of the deep UV (248-193 nm) positive resist materials that have occurred in the last quarter century. ©1998TAPJ.
Joy Y. Cheng, Daniel P. Sanders, et al.
SPIE Advanced Lithography 2008
P. Martensson, R.M. Feenstra
Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films
R.M. Macfarlane, R.L. Cone
Physical Review B - CMMP
Mitsuru Ueda, Hideharu Mori, et al.
Journal of Polymer Science Part A: Polymer Chemistry