A. Deutsch, H. Smith, et al.
IEEE Topical Meeting EPEPS 1997
This paper describes the use of a 12×12 SCM power supply distribution model, a 50×50 on-chip power bus model, and a distributed switching circuit model to analyze the on-chip power supply noise for high-performance VLSI design. The integrated model provides a complete analysis of the Vdd distribution, and allows designers to identify the hot spots on the chip and optimize design variables to minimize the noise.
A. Deutsch, H. Smith, et al.
IEEE Topical Meeting EPEPS 1997
E. Chiprout, Tuyen V. Nguyen
IEEE Topical Meeting EPEPS 1997
Howard H. Chen, L.K. Wang
VLSI-TSA 1997
Howard H. Chen
MWSCAS 1989