G. Almasi, G. Almasi, et al.
Digest of Technical Papers - IEEE International Solid-State Circuits Conference
The importance of inductance and inductive coupling for accurate delay and crosstalk prediction in on-chip interconnections is investigated experimentally for the top three layers in a five-layer wiring structure and guidelines are formulated. In-plane and between-plane crosstalk and delay dependence on driver and receiver circuit device sizes and line lengths and width are analyzed with representative CMOS circuits. Simplified constant-parameter, distributed coupled-line RLC-circuit representation that approximates the waveforms predicted with frequency-dependent line parameters is shown feasible.
G. Almasi, G. Almasi, et al.
Digest of Technical Papers - IEEE International Solid-State Circuits Conference
A. Deutsch, W.D. Becker, et al.
IEEE Topical Meeting EPEPS 1996
A. Deutsch, G. Arjavalingam, et al.
ECTC 1994
James Warnock, Y.-H. Chan, et al.
ISSCC 2011