Clarissa Convertino, C. B. Zota, et al.
IEDM 2018
The monolithic integration of power-efficient optoelectronic devices with CMOS circuits is critical for future on-chip optical communication. In such platforms, ultra-high-speed photodetectors operating at datacom wavelengths are essential to convert optical signals in the electrical domain. Here, we demonstrate ultra-compact high-speed III-V/Si photodetectors integrated on silicon photonics and exclusively fabricated with processes and materials compatible with CMOS foundries. The sub-femtofarad capacitance, high responsivity photodetectors demonstrate a bandwidth around 65 GHz and data reception at 100 GBd OOK. Their thickness and efficiency enable an integration in the back-end-of-line without using an amplifier, further reducing the power consumption of the link.
Clarissa Convertino, C. B. Zota, et al.
IEDM 2018
Erik Cheah, Daniel Z. Haxell, et al.
Physical Review Materials
Felix Eltes, Daniele Caimi, et al.
ACS Photonics
Yannick Baumgartner, Marc Seifried, et al.
OFC 2019