Peter J. Price
Surface Science
This paper investigates and reviews the effects of wafer bow in three- dimensional (3D) integration bonding schemes, including copper wafer bonding and oxide fusion wafer bonding with silicon on insulator (SOI)-based layer transfer technology. Wafer bow criteria for good bonding quality and fabrication techniques to minimize wafer bow are introduced for 3D integration technology and applications. © 2010 TMS.
Peter J. Price
Surface Science
Ranulfo Allen, John Baglin, et al.
J. Photopolym. Sci. Tech.
A. Nagarajan, S. Mukherjee, et al.
Journal of Applied Mechanics, Transactions ASME
Q.R. Huang, Ho-Cheol Kim, et al.
Macromolecules