Comparison of electromigration performance for Pb-free solders and surface finishes with Ni UBM
- Minhua Lu
- Paul Lauro
- et al.
- 2008
- ECTC 2008
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15 results for Donald W. Henderson
The influence of low level doping on the thermal evolution of SAC alloy solder joints with Cu pad structures
- Isabel De Sousa
- Donald W. Henderson
- et al.
- 2006
- ECTC 2006
Evaluation of thermal fatigue life and failure mechanisms of Sn-Ag-Cu solder joints with reduced Ag contents
- Sung K. Kang
- Paul Lauro
- et al.
- 2004
- ECTC 2004
Formation of Ag3Sn plates in Sn-Ag-Cu alloys and optimization of their alloy composition
- Sung K. Kang
- Won Kyoung Choi
- et al.
- 2003
- ECTC 2003
Interfacial reaction studies on lead (Pb)-free solder alloys
- S.K. Kang
- D.Y. Shih
- et al.
- 2001
- ECTC 2001
The microstructure, thermal fatigue, and failure analysis of near-ternary eutectic Sn-Ag-Cu solder joints
- Sung K. Kang
- Paul Lauro
- et al.
- 2004
- Materials Transactions
Effect of Sn grain orientation on electromigration degradation mechanism in high Sn-based Pb-free solders
- Minhua Lu
- Da-Yuan Shih
- et al.
- 2008
- Applied Physics Letters
Interfacial reactions of Sn-Ag-Cu solders modified by minor Zn alloying addition
- Sung K. Kang
- Donovan Leonard
- et al.
- 2006
- Journal of Electronic Materials
Microstructure and mechanical properties of lead-free solders and solder joints used in microelectronic applications
- Sung K. Kang
- Paul A. Lauro
- et al.
- 2005
- IBM J. Res. Dev
The microstructure of Sn in near-eutectic Sn-Ag-Cu alloy solder joints and its role in thermomechanical fatigue
- Donald W. Henderson
- James J. Woods
- et al.
- 2004
- Journal of Materials Research