J. Woodall, H.J. Hovrl
Journal of Crystal Growth
We show that ε1-Cu3Ge forms a low-resistance ohmic contact to n-type GaAs. The ε1-Cu3Ge contact exhibits a planar and abrupt interface and contact resistivity of 6.5×10-7 Ω cm2 which is considerably lower than that reported for Ge/Pd and AuGeNi contacts on n-type GaAs with similar doping concentrations (∼1×1017 cm-3). The contact is electrically stable during annealing at temperatures up to 450°C. We also show that in the Ge/Cu/n-type GaAs system, the contact remains ohmic over a wide range of Ge concentration that extends from 15 to 40 at. %. n-channel GaAs metal-semiconductor field-effect transistors using the ε1-Cu3Ge ohmic contacts demonstrate a higher transconductance compared to devices with Ge/Pd and AuGeNi contacts. © 1994 American Institute of Physics.
J. Woodall, H.J. Hovrl
Journal of Crystal Growth
Chu R. Wie, G. Burns, et al.
Nuclear Inst. and Methods in Physics Research, B
H.J. Hoffmann, J. Woodall
Applied Physics A Solids and Surfaces
J. Woodall, H. Rupprecht, et al.
IEEE T-ED