Dependence of post-breakdown conduction on gate oxide thickness
S. Lombardo, J.H. Stathis, et al.
Microelectronics Reliability
We show that silicon dangling bonds with different nearest-neighbor configurations and energy levels can be resolved by electron spin resonance (ESR) in silicon nitride. Using an in situ bias technique on large-area metal-nitride-silicon structures, we demonstrate that the ESR line in Si-rich nitride consists of an inhomogeneous distribution of discrete components at different g values. We show that trapping of holes occurs at a site with a g value of 2.0052 corresponding to a pure Si environment, while electron trapping occurs at a site with a g value of 2.0028, corresponding to a pure N environment.
S. Lombardo, J.H. Stathis, et al.
Microelectronics Reliability
Jerzy Kanicki, D. Jousse
IEEE Electron Device Letters
M. Zelikson, J. Salzman, et al.
Applied Physics Letters
J.H. Stathis, E. Cartier
Physical Review Letters