Pascal Stark, Felix Eltes, et al.
OFC 2020
We present a versatile electro-optical packaging platform for optical transceiver modules suitable for very high aggregate I/O capacity, as required, for example, in (disaggregated) datacenters and servers. Real-estate limitations on the board or on the processor package laminate are overcome by using a flexible printed circuit board substrate that is folded around a solid body, resulting in a 3-D package assembly. A 48 Gb/s × 10 Gb/s transceiver prototype is demonstrated as well as the design path toward a transceiver with 1.2-Tb/s aggregate I/O bandwidth. Accounting for large-scale manufacturing and deployment, we explicitly address the requirements of the optical, mechanical, thermal, and electrical interfaces as well as of all associated manufacturing processes.
Pascal Stark, Felix Eltes, et al.
OFC 2020
Thomas Brunschwiler, Jonas Weiss, et al.
GIoTS 2019
Roger Dangel, Folkert Horst, et al.
IPC 2014
Laura Begon-Lours, Mattia Halter, et al.
EDTM 2021