Foreword: Special Section on Packaging and Interconnects: Cutting-Edge Solutions in Modeling, Design, and Characterization - Part i
- Mihai Telescu
- Xiaoxiong Gu
- et al.
- 2019
- IEEE Transactions on CPMT
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29 results at IEEE Transactions on CPMT
Modeling effect of grain orientation on degradation in tin-based solder: I. current-driven diffusion
- Yuanxiang Zhang
- Jiamin Ni
- et al.
- 2019
- IEEE Transactions on CPMT
Improving Data Center Energy Efficiency With Advanced Thermal Management
- Timothy Chainer
- Mark D. Schultz
- et al.
- 2017
- IEEE Transactions on CPMT
Fabrication and Performance of 300-mm Wafer-Scale Silicon Microchannel Cooler
- Evan G. Colgan
- Kai Schleupen
- et al.
- 2023
- IEEE Transactions on CPMT
3-D Die Stacking with 55 μm Pitch Interconnections on Advanced Ground-Rule Laminate for Artificial Intelligence System
- Katsuyuki Sakuma
- Mukta Farooq
- et al.
- 2021
- IEEE Transactions on CPMT
Modeling Effect of Grain Orientation on Degradation in Tin-Based Solder - Part II: Electromigration Experiments
- Jiamin Ni
- Matt Ring
- et al.
- 2019
- IEEE Transactions on CPMT
Thermally Conductive Composite Material with Percolating Microparticles Applied as Underfill
- Rahel Straessle
- Severin Zimmermann
- et al.
- 2018
- IEEE Transactions on CPMT
Efficient Prediction of Equalization Effort and Channel Performance for PCB-Based Data Links
- Torsten Reuschel
- Jan B. Preibisch
- et al.
- 2017
- IEEE Transactions on CPMT
Optical Transceiver Module for 1.2 Tb/s Based on Flexible Circuit Technology
- Jonas Weiss
- Daniel Jubin
- et al.
- 2017
- IEEE Transactions on CPMT
Enhanced percolating thermal underfills achieved by means of nanoparticle bridging necks
- Jonas Zürcher
- Xi Chen
- et al.
- 2016
- IEEE Transactions on CPMT