Optical Transceiver Module for 1.2 Tb/s Based on Flexible Circuit Technology
- Jonas Weiss
- Daniel Jubin
- et al.
- 2017
- IEEE Transactions on CPMT
Publications
Date
Featured collections
Popular topics
12 results for Stefano Oggioni
Embedded power insert enabling dual-side cooling of microprocessors
- Thomas Brunschwiler
- Dominic Gschwend
- et al.
- 2015
- ECTC 2015
Thermal power plane enabling dual-side electrical interconnects for high-performance chip stacks: Implementation
- Thomas Brunschwiler
- Timo Tick
- et al.
- 2014
- ESTC 2014
Thermal power plane enabling dual-side electrical interconnects for high-performance chip stacks: Concept
- Thomas Brunschwiler
- Ralph Heller
- et al.
- 2014
- ESTC 2014
Laminate with thermal - Power insert for efficient front-side heat removal and power delivery
- Dominic Gschwend
- Timo Tick
- et al.
- 2014
- CIPS 2014
Investigation of novel solder patterns for power delivery and heat removal support
- Thomas Brunschwiler
- Yassir Madhour
- et al.
- 2013
- ECTC 2013
Polymer-waveguide-based board-level optical interconnect technology for datacom applications
- Roger Dangel
- Christoph Berger
- et al.
- 2008
- IEEE Transactions on Advanced Packaging
Integration of optical I/O with organic chip packages
- Bert J. Offrein
- Christoph Bergen
- et al.
- 2008
- SPIE Photonics Europe 2008
Integration of optical I/O with organic chip packages
- Christoph Berger
- Laurent Dellmann
- et al.
- 2008
- SPIE IOPTO 2008
120 Gb/s optical card-to-card interconnect link demonstrator with embedded waveguides
- L. Dellmann
- C. Berger
- et al.
- 2007
- ECTC 2007