Xiaoxiong Gu, Dong Gun Kam, et al.
ECTC 2013
A multilayer organic package with embedded 60-GHz antennas and fully integrated with a 60-GHz phased-array transmitter or receiver chip is demonstrated. The package includes sixteen phased-array antennas, an open cavity for housing the flip-chip attached RF chip, and interconnects operating at DC-66 GHz. The 28 mm × 28 mm ball grid array package is manufactured using printed circuit board processes and uses a combination of liquid-crystal polymer and glass-reinforced laminates, allowing excellent 60-GHz interconnect and antenna performance. The measured return loss and gain of each antenna from 56 to 66 GHz are ∼10 dB and ∼5 dBi, respectively. Finally, the packaged transmitter and receiver chipsets, each working with a heat sink, have demonstrated beam-steered, non-line-of-sight links with data rates up to 5.3 Gb/s using 16-quadrature amplitude modulation single-carrier and orthogonal frequency division multiplexing schemes. © 2011 IEEE.
Xiaoxiong Gu, Dong Gun Kam, et al.
ECTC 2013
Xiaoxiong Gu, Dong Gun Kam, et al.
ECTC 2013
Dong Gun Kam, Joungho Kim
IEEE Transactions on Advanced Packaging
Duixian Liu, Brian Gaucher
iWAT 2007