Conference paper
High-throughput photonic packaging
Tymon Barwicz, Ted W. Lichoulas, et al.
OFC 2017
We realized a passively aligned waveguide connector for a silicon photonic chip packaging. We used lithographically defined top clad patterning to realize fine alignment grooves which mate with notches in the ferrule passively. © OSA 2012.
Tymon Barwicz, Ted W. Lichoulas, et al.
OFC 2017
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ECTC 2017
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ECTC 2016
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