Conference paper
Effects of Al and Mn impurities on Cu electromigration
C.-K. Hu, J. Ohm, et al.
ADMETA 2011
We discuss the process challenges such as the heater geometry effect, heater patterning processes and deep via formation. Based on the electrical data, we improve the processes and Phase Change memory (PCM) resistance distribution to meet Analog Computing requirement.
C.-K. Hu, J. Ohm, et al.
ADMETA 2011
C.-K. Hu, J. Ohm, et al.
Journal of Applied Physics
Pritish Narayanan, Stefano Ambrogio, et al.
IEEE T-ED
Victor Chan, M. Bergendahl, et al.
ASMC 2020