Yield Methodology and Heater Process Variation in Phase Change Memory (PCM) Technology for Analog ComputingVictor ChanA. Gasasiraet al.2023IEEE Trans Semicond Manuf
Process Challenge in Analog Computing Hardware using Phase Change Memory (PCM)Victor ChanI. Oket al.2023ASMC 2023
A no-verification Multi-Level-Cell (MLC) operation in Cross-Point OTS-PCMNanbo GongW. Chienet al.2020VLSI Technology 2020
High performance 14nm SOI FinFET CMOS technology with 0.0174μm2 embedded DRAM and 15 levels of Cu metallizationC.-H.C-H. LinBrian Greeneet al.2014IEDM 2014
Bottom oxidation through STI (BOTS) - A novel approach to fabricate dielectric isolated FinFETs on bulk substratesK. ChengS.-C. Seoet al.2014VLSI Technology 2014
High performance bulk planar 20nm CMOS technology for low power mobile applicationsHuiling ShangSameer Jainet al.2012VLSI Technology 2012
Channel Strain Characterization in Embedded SiGe by Nano-beam DiffractionJ. LiA. Lambertiet al.2008ECS Meeting 2008
Higher hole mobility induced by twisted Direct Silicon Bonding (DSB)M. HamaguchiH. Yinet al.2008VLSI Technology 2008
High performance transistors featured in an aggressively scaled 45nm bulk CMOS technologyZ. LuoN. Rovedoet al.2007VLSI Technology 2007