Signal and Power Integrity Design and Analysis for Bunch-of-Wires (BoW) Interface for Chiplet Integration on Advanced Packaging

Abstract

This work advances the current understanding and performance assessment of chiplet interfaces by providing a framework for modeling and joint simulation of signal and power integrity of BoW-based die-to-die interconnects with advanced packaging technology. The study covers data rates up to 16 Gbps. This paper presents a circuit-level implementation of the BoW slice that consists of a driver on one chiplet and a receiver on another chiplet. This work compares the performance of various combinations of high-density transmission lines with different line-and-space and wirelengths. It presents configurations of the BoW data lines that have extremely low power dissipation, less than 0.2 pJ/bit at 8 and 16 Gbps.